Warp-Recovery Printed Circuit Board Warping Correction Device
Eliminate defects in electronic component mounting by correcting warpage of printed circuit boards! Energy-saving and space-saving inline warpage correction device.
"Warp-Recovery" is a device that corrects warping that occurs during substrate manufacturing by passing it through heated press rollers and press cooling rollers. It corrects warping of printed circuit boards, eliminating manufacturing defects caused by warping. As chip components continue to miniaturize, this system will increasingly be required in both substrate manufacturing and component mounting. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ Inline warping correction ■ Equipped with clean rollers to prevent dust and debris ■ Space-saving design with a total installation length of 3m ■ Adoption of heated press rollers and press cooling rollers *For more details, please refer to the PDF document or feel free to contact us.
- 企業：ダイナトロン
- 価格：Other
